emccompo2013.org
EMC Compo 2013 - Program Committee
http://www.emccompo2013.org/TPC.html
Shibaura Institute of Technology. Koga, Liuji R. Ben Dhia, Sonia. Hitachi, Ltd.,. Kim, Joung Ho. Park, Hyun Ho. The University of Suwon. US, US.A. Missouri University of Science and Technology. US, US.A.
emccompo2013.org
EMC Compo 2013 - Technical Program
http://www.emccompo2013.org/program.html
Technical Program is open here. Https:/ www.conftool.net/emccompo2013/sessions.php. Date and Time: 9:00-9:45, December 15. Devices, Circuits, Packages and Systems Understanding their Interplay for. Managing Signal, Power and Thermal Integrity. John Pippin Chair in Electromagnetics. Director, Interconnect and Packaging Center. School of Electrical and Computer Engineering, Georgia Institute of Technology. Date and Time: 9:45-10:30, December 15. The Pathways to Cost-Effective Power/Signal Integrity Designs.
emccompo2013.org
EMC Compo 2013 - Important dates
http://www.emccompo2013.org/important_dates.html
Please take note of the following important dates. For EMC Compo 2013:. Deadline for paper submission.
emccompo2013.org
EMC Compo 2013 - Instructions for Authors
http://www.emccompo2013.org/instructions_for_authors.html
Should be written in English. And may not exceed six pages, including all figures, tables, references, etc. The accepted file format is IEEE compatible Adobe PDF (.pdf). Only Please check that all the fonts used in your document are embedded in the .pdf file. The electronic version of the papers will be compiled in a USB key, which will be given to attendees as part of their workshop registration, and will also be included in IEEE Xplore as part of the workshop proceedings. Of IEEE PDF eXpress tool.
emccompo2013.org
EMC Compo 2013 - Related Links
http://www.emccompo2013.org/links.html
Http:/ edaps2013.dept.eng.gunma-u.ac.jp/. Http:/ www.peritec.co.jp/. Http:/ www.peritec.co.jp/product/emi en.html. Http:/ www.technoalpha.co.jp/english/. Http:/ www.zuken.com/en/. Microwave Factory Co.,Ltd. Http:/ www.mwf.co.jp/. Http:/ www.advantest.com/. Http:/ www.apache-da.com/. Http:/ www.first-cad.com/English FIRST/Eindex.html. Http:/ culturecenter.todaiji.or.jp/. Nara City Sightseeing Information Center. Http:/ narashikanko.or.jp/en/. Nara Hotel(Banquet hall in the hotel).
emccompo2013.org
EMC Compo 2013 - Workshop Venue
http://www.emccompo2013.org/venue.html
100 Suimon-cho, Nara City. Http:/ culturecenter.todaiji.or.jp/. Access to Todaiji Cultural Center. From JR Nara Station. Take a ' City Circular(outer tracks)' bus Nara Kotsu bus, get off at ' Daibutuden Kasugataisya-mae,' and walk northeastward for 5 minutes. From Kintetsu Nara Station. Take a ' City Circular(outer tracks)' bus Nara Kotsu bus, get off at ' Daibutuden Kasugataisya-mae,' and walk northeastward for 5 minutes. Walk eastward for 15 minutes. Access to NARA city. BUS & TRAIN]. Osaka Airport(Ita...
emccompo2013.org
EMC Compo 2013 -
http://www.emccompo2013.org/topics.html
The 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits is specifically focused on EMC for integrated circuits. Contributions related, but not limited, to the following topics, are welcome:. A) Measurement and modeling of IC emission and susceptibility. B) Signal Integrity and Power Integrity on IC and PCB-level. C) EMC-aware IC Design and guidelines. D) Tools to handle EMC at IC-level. E) Computational electromagnetics for IC-level EMC. G) EMC issues in smart power ICs.
emccompo2013.org
EMC Compo 2013 - Symposium Schedule
http://www.emccompo2013.org/symposiumschedule.html
Visit to Museum (Walking Tour) &. Walking Tour: Nara Buddist Sculpture Hall http:/ www.narahaku.go.jp/english/. Welcome Reception (After Walking Tour). Banquet and Award Ceremony.
emcmcc.nl
EMCMCC.nl
http://www.emcmcc.nl/en/index.php
ESDA-IEW: "Bridging the gap between IC design and its application". A contribution will be given on the development of measurement methods to be used at the intermediate level, being the assembled PCBs. These small, even up to larger PCBs used in 19-inch racks need to be qualified prior to release and/or integration into a larger system. A chain of measurement methods is set which can be used from the IC level up to the system qualification level. Workshop High-end IC decoupling strategies. The book is o...
emcmcc.nl
EMCMCC.nl
http://www.emcmcc.nl/en/new_products.php
ESDA-IEW: "Bridging the gap between IC design and its application". A contribution will be given on the development of measurement methods to be used at the intermediate level, being the assembled PCBs. These small, even up to larger PCBs used in 19-inch racks need to be qualified prior to release and/or integration into a larger system. A chain of measurement methods is set which can be used from the IC level up to the system qualification level. Workshop High-end IC decoupling strategies. The book is o...