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1

Wafer-Bumping product offerings

http://www.wafer-bumping.com/documents/resources/equip_link.html

With more than 35 years of experience in equipment design and manufacture and over 10 years of experience in Advanced Packaging Suss MicroTec is today the leader for specialized lithography equipment for packaging applications. Suss MicroTec product offerings include coating and development systems as well as mask aligners. S-Cubed (S3) Provides Value Engineered Process Systems to the Semiconductor and Allied Industries. S3 to offer new equipment at costs that often are lower than used or rebuilt equ...

2

Wafer-Bumping product offerings

http://www.wafer-bumping.com/documents/products/products.html

Masks for Bumping and Wafer Level Packaging. Over the past 20 years, we have developed a database of test patterns and combined them in a mask set. The purpose of the masks is to provide economical and versatile photolitho tools, particularly useful for process development, process validation, or final reliability qualification of a bumping product line. We can short-circuit this process, save you many design iterations, and provide you with a roadmap for development. You can also use the masks to ch...

3

Wafer-Bumping product offerings

http://www.wafer-bumping.com/documents/services/services.html

Services to meet your challenges. We provide expertise for your WLP and bumping projects:. Wafer-Bumping can help you meet your fabrication challenges with a unique combination in thin film, polymers materials and process expertise. We provide services for all aspects of flip-chip and wafer-level packaging:. Select a bumping vendor. Design and layout of interconnect. Design new bumping processes. Select appropriate fab equipment. New Business Engineering Development. Selecting a Bumping Vendor. We can sp...

4

Wafer-Bumping and Packaging Facilities

http://www.wafer-bumping.com/documents/resources/bmp_link.html

Bumping and Packaging Links. Bumping and Packaging Sources. FlipChip International is a provider of merchant Wafer Level Packaging (WLP) and flip chip bumping to the semiconductor market through its Phoenix Arizona facility and five global licensees. Services provided include: Standard Flip Chip (SFC, formally known as Flex-on-Cap"! Redistributed SFC, Wafer UltraCSP"! High Frequency RF Packaging), EliteCSP"! A low cost E-less Nickel bumping WLCSP), and Polymer Collar"! Only search Wafer-Bumping site.

5

Wafer-Bumping product offerings

http://www.wafer-bumping.com/documents/services/reliability.html

Test, test and test again…. We can provide support to prepare for reliability tests and help you with the statistical analysis as necessary. Without reliability, WLP or any bumping is useless. There are a number of essential tests that need to be performed to validate the reliability of processes and performance of completed parts. For example:. Temperature and humidity under electrical bias. Dielectric constant (e' and e) vs. frequency. Dielectric constant (e' and e) vs. humidity. The quickest common in...

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